Hisense Mira

Operating System
Operating System
Google Android
Screen
Screen
127 mm, 5 inch
CPU
CPU
Qualcomm Snapdragon 200 MSM8625Q (Snapdragon S4 Play)
RAM
RAM
mobile (LP) DDR2 SDRAM
Storage
Storage
4 GB
Main Camera
Main Camera
8.0 MP
Battery
Battery
2000 mAh

Hisense Mira Prices


Hisense Mira Key Specifications


Brand
Hisense
Model
Hisense Mira
Version
EG970
Category
Smartphones
Released Date
2013-06-01
Operating System
Google Android
OS Version
Google Android 4.1.2 (Jelly Bean)
CPU
Qualcomm Snapdragon 200 MSM8625Q (Snapdragon S4 Play)
Graphics Processor
Qualcomm Adreno 203
RAM
mobile (LP) DDR2 SDRAM
RAM Capacity
1 GB
Main Camera
8.0 MP
Screen
127 mm, 5 inch
Pixel Density
220 PPI
Resolution
540x960
Storage
4 GB
Battery
2000 mAh
Weight
145 g, 5.11 ounces

Hisense Mira Technical Specifications


Product Overview

Brand
Hisense
Manufacturer
Hisense
Model
Hisense EG970 Mira
Version
EG970
Category
Smartphones
Country
China

Design

BODY

Height
  • 142 mm
  • 5.59 inch
Width
  • 72.7 mm
  • 2.86 inch
Weight
  • 145 g
  • 5.11 ounces
Thickness
  • 0.34 inches
  • 8.7 mm
Colors
Grey

Camera

BACK CAMERA

Focus
Contrast Detection Autofocus (CD AF)
Resolution
8.0 MP
Resolution (h x w)
3264x2448 pixel
Video format
MPEG4
Video resolution
  • 1920x1080 pixel
  • 30 fps
Image format
JPG
Zoom
1.0 x optical zoom
Flash
single LED
Features
  • HDR photo
  • Macro mode
  • Panorama Photo
Sensor
CMOS

FRONT CAMERA

Resolution
0.3 MP
Resolution (h x w)
640x480 pixel
Video resolution
  • 640x480 pixel
  • 30 fps
Video format
3GP
Image format
JPG
Sensor
CMOS

Display

Diagonal
  • 127 mm
  • 5 inch
Resolution (h x w)
540x960
Pixel density
220 PPI
Width
  • 62.26 mm
  • 2.45 inch
Height
  • 110.69 mm
  • 4.36 inch
Pixel size
0.1153 mm/pixel
Color depth
24 bit
Subpixels
RGB Matrix (3 subpixels)
Number of colors
16.8M
Screen to body ratio
66.8%
Bezel width
  • 10.44 mm
  • 0.41 inch(es)
Touchpoints
Multi touch
Touch screen type
Capacitive

Internal Components

SOFTWARE

Os
Google Android
Os version
Google Android 4.1.2 (Jelly Bean)

PROCESSOR

Cpu
Qualcomm Snapdragon 200 MSM8625Q (Snapdragon S4 Play)
Cpu clock speed
1200 MHz
Gpu
Qualcomm Adreno 203
Gpu dedicated memory
262.25 KB

RAM

Type
mobile (LP) DDR2 SDRAM
Capacity
1 GB
Clock speed
533 MHz

STORAGE

Type
Flash EEPROM
Capacity
4 GB
Expansion
  • TransFlash
  • MicroSD
  • MicroSDHC

AUDIO

Channel
stereo
Output
3.5mm
Microphone
stereo

CELLULAR

Sim frequencies
CDMA 800MHz (BC0, 850) bands
Sim mobile data
  • cdmaOne (IS-95)
  • CDMA2000 1xRTT (IS-2000)
  • CDMA2000 1xEV-DO Rel. 0
  • CDMA2000 1xEV-DO Revision A data links
Sim ii frequencies
  • GSM 900MHz (B8)
  • GSM 1800MHz (B3)
  • GSM 1900MHz (PCS, B2)
Sim ii mobile data
  • GPRS (Class unspecified)
  • EDGE (Class unspecified)
Sim ii module
Qualcomm MSM8625Q
Dual sim type
Dual standby
Carrier
China Telecom Corporation Limited
Generation
3G
Sim type
Dual

WIRELESS

Bluetooth version
2.0
Bluetooth profiles
  • A2DP
  • AVRCP
Wifi
  • IEEE 802.11b
  • IEEE 802.11g
  • IEEE 802.11n
Wifi features
DLNA
Experiences
FM Radio

PORTS

Usb type
  • Type AB
  • Micro USB
Usb version
  • 2.0
  • Hi-Speed (480 Mbps)
Usb features
  • charging
  • Host
  • On-The-Go 1.3
  • Power Delivery

BATTERY

Type
Lithium-ion — 1 cell
Cell i
2000 mAh
Capacity
2000 mAh
Style
Removable

LOCATION

Chip
Qualcomm MSM8625Q gpsOne
Additional features
GPS

SENSORS

Sensors
  • Light intensity sensor
  • Accelerometer
  • Compass

Not available

AV Out
AV Out
720 x 1280 pixels
LPDDR2/LPDDR3
294 ppi
3000 mAh
720 x 1280 pixels
LPDDR3
294 ppi
3900 mAh
1080 x 2340 pixels
LPDDR4X
395 ppi
5510 mAh
720 x 1440 pixels
LPDDR3
295 ppi
2450 mAh
1080 x 2340 pixels
LPDDR4X
395 ppi
4510 mAh
720 x 1600 pixels
LPDDR4/LPDDR4X
268 ppi
5100 mAh
1080 x 2400 pixels
LPDDR4X
386 ppi
5010 mAh

User Reviews for Hisense Mira


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