i-teq Bond

Operating System
Operating System
Windows Mobile
Screen
Screen
63.5 mm, 2.5 inch
CPU
CPU
Intel XScale PXA272 (Bulverde)
RAM
RAM
SDRAM
Main Camera
Main Camera
2.0 MP
Battery
Battery
1300 mAh

i-teq Bond Prices


i-teq Bond Key Specifications


Brand
i-teq
Model
i-teq Bond
Category
Smartphones
Released Date
2006-05-01
Operating System
Windows Mobile
OS Version
Microsoft Windows Mobile 5.0 for Pocket PC Phone Edition (Magneto), AKU 2.0
CPU
Intel XScale PXA272 (Bulverde)
Graphics Processor
N/A
RAM
SDRAM
Main Camera
2.0 MP
Screen
63.5 mm, 2.5 inch
Pixel Density
160 PPI
Resolution
240x320
Battery
1300 mAh
Weight
153 g, 5.4 ounces

i-teq Bond Technical Specifications


Product Overview

Brand
i-teq
Manufacturer
Gigabyte Technology
Model
i-teq Bond
Category
Smartphones

Design

BODY

Height
  • 109 mm
  • 4.29 inch
Width
  • 53.5 mm
  • 2.11 inch
Weight
  • 153 g
  • 5.4 ounces
Thickness
  • 0.94 inches
  • 24 mm
Colors
Black

KEYBOARD

Keys
12
Backlight
LED

PERIPHERAL

Peripheral
D Pad

Camera

BACK CAMERA

Resolution
2.0 MP
Resolution (h x w)
1680x1200 pixel
Video format
  • 3GP
  • MPEG4
  • WMV
Video resolution
  • 320x240 pixel
  • 30 fps
Image format
JPG
Zoom
1.0 x optical zoom
Flash
single LED
Features
Macro mode
Sensor
CMOS

Display

Diagonal
  • 63.5 mm
  • 2.5 inch
Resolution (h x w)
240x320
Pixel density
160 PPI
Width
  • 38.1 mm
  • 1.5 inch
Height
  • 50.8 mm
  • 2 inch
Pixel size
0.15875 mm/pixel
Color depth
18 bit
Subpixels
RGB Matrix (3 subpixels)
Number of colors
262144
Screen to body ratio
33.2%
Bezel width
  • 15.4 mm
  • 0.61 inch(es)
Lcd mode
transflective
Touchpoints
1
Touch screen type
Resistive

Internal Components

SOFTWARE

Os
Windows Mobile
Kernel version
5.1.195 Build 14929.2.1.0
Os version
  • Microsoft Windows Mobile 5.0 for Pocket PC Phone Edition (Magneto)
  • AKU 2.0

PROCESSOR

Cpu
Intel XScale PXA272 (Bulverde)
Cpu clock speed
416 MHz
Gpu
N/A

RAM

Type
SDRAM

STORAGE

Type
Flash EEPROM
Expansion
  • SDIO
  • MiniSD

AUDIO

Dac resolution
16 bit
Channel
stereo
Output
2.5mm
Microphone
mono

CELLULAR

Sim slot
Mini-SIM (2FF)
Sim frequencies
  • GSM 900MHz (B8)
  • GSM 1800MHz (B3)
  • GSM 1900MHz (PCS, B2) bands
Sim mobile data
  • CSD 9.6 kbps
  • GPRS (Class unspecified)
  • GPRS Class 10
  • EDGE (Class unspecified) data links
Generation
3G
Sim type
Single

WIRELESS

Bluetooth version
1.2.1
Bluetooth profiles
A2DP
Wifi
IEEE 802.11b
Experiences
  • FM Radio
  • Infrared
  • Analog TV

PORTS

Usb type
  • Type B
  • Mini USB
Usb version
  • 1.1
  • Full-Speed (12 Mbps)

BATTERY

Type
Lithium-ion — 1 cell
Cell i
1300 mAh
Capacity
1300 mAh
Style
Removable
Current
130 mA
Life
10.0 hours

LOCATION

Additional features
GPS

SENSORS

Sensors
Accelerometer

Not available

GPS
GPS
Focus
Sensor
Front Camera
AV Out
AV Out
SIM II Frequencies
Dual SIM
Accelerometer
Accelerometer
240x320
SDRAM
141 PPI
1100 mAh
240x320
SDRAM
167 PPI
1300 mAh
1080 x 2408 pixels
LPDDR4X
401 ppi
13000 mAh
720x1600
4 GB
270 PPI
4950 mAh
720 x 1440 pixels
LPDDR3
295 ppi
4000 mAh
1080 x 2400 pixels
LPDDR4X
402 ppi
4250 mAh
1080 x 2246 pixels
LPDDR4X
402 ppi
3300 mAh

User Reviews for i-teq Bond


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